教授課程

X-ray繞射及結晶學、材料實驗(一)、冶金熱力學、電子構裝技術、材料相平衡、物理化學(I)、書報討論

榮譽獎項

1995 Award of a fine piece of writing in love letters by Department of Chinese Literature National Tsing Hau University
2000 Outstanding paper award by the Chinese Society for Ruin Science
2000 Scholarship for joining International Conferences by K T Li Foundation of the Development of Science and Technology
2000 Outstanding paper prize of Students by the Chinese Society for Materials Science
2001 Sandwich Scholarship by NSC (Taiwan) and DAAD (Germany)
2003 An honorary member of The Phi Tau Phi Scholastic Honor Society of the Republic of China
2005,2007, 2008 Outstanding paper award by the Taiwan Printed Circuit Association
2006 Young Leader Intern Program (TMS)
2006 Outstanding paper of "1st National conference on Hydrogen Energy and Feul Cell"

 期刊論文

• Interfacial Reaction in Molten Sn/Cu and Molten In/Cu Couples, Lee-ho Su, Yee-wen Yen, Chao-ching Lin and Sinn-wen Chen, METALLURGICAL AND MATERIALS TRANSACTION B, vol. 28B, pp.927-934 (1997). (SCI: 0.621)
• Interfacial Reactions in Ag-Sn/Cu Couples, Sinn-wen Chen and Yee-wen Yen, Journal of Electronic Materials, vol. 28, pp.1203-1208 (1999). (SCI: 1.320)
• Nickel and copper deposition on fine alumina particles by using the chemical vapor deposition-circulation fluidized bed reactor technique, Yee-wen Yen and Sinn-wen Chen, Journal of Materials Science, vol.35, pp.1439-1444 (2000). (SCI: 1.081)
• Interfacial Reactions in the Sn-Ag/Au Couples, Sinn-wen Chen and Yee-wen Yen, Journal of Electronic Materials, vol. 30, pp.1133-1137 (2001). (SCI: 1.320) 
• Thermodynamic Assessment of the Hg-Sn System, Yee-wen Yen, Joachim Gröbner, Steve C. Hansen, and Rainer Schmid-Fetzer, Journal of Phase Equilibria, vol. 24, pp.151-167 (2003). (SCI: 0.449)
• Phase equilibria of the Ag-Sn-Cu ternary systems, Yee-wen Yen and Sinn-wen Chen, Journal of Materials Research, vol. 19, pp. 2298-2305 (2004). (SCI: 1.916)
• Evaluation of the thermal stability of reactively of sputtered (Ti, Zr)N_x nano-thin films as diffusion barriers between Cu and Silicon, Yu-Lin Kuo, Chiapyng Lee, Jing-Cheng Lin, Yee-wen Yen and Wen-Horng Lee, Thin Solid Films, vol. 484, pp. 265-271 (2005) (SCI: 1.693)
• Reaction Mechanism of the Two-Step MOCVD of Copper Thin Film Using Cu(hfac)2·H2O Source, Chiapyng Lee, Hsin-Hung Lee, Yee-wen Yen and Yu-Kin Kuo, Electrochemical and Solid-State Letters, vol. 8, pp. G307-G310 (2005) (SCI: 2.109)
• A novel two-step MOCVD for producing thin copper films with a mixture of ethyl alcohol and water as the additive, Hsin-Hung Lee, Chiapyng Lee, Yu-Lin Kuo and Yee-wen Yen, Thin Solid Films, vol. 498, pp. 43-49 (2006) (SCI: 1.693)
• Mesoporous, self-assembled palladium nanospheres: High efficiency activator for electroless nickel deposition, Chien-Liang Lee^g, Li-Chen Kuo, Yu-Ching Huang^g, Yee-Wen Yen, Electrochemistry Communications, vol. 8, pp. 697-702 (2006). (SCI: 4.186)
• The activation effect of Pd nanoparticles on electroless nickel-phosphorous deposition, Li-Chen Kuo, Yu-Ching Huang, Chien-Liang Lee, Yee-Wen Yen, Electrochimica Acta, vol. 52, pp. 353-360 (2006) (SCI: 2.848)
• Effects of Cu addition on the Interfacial Reaction between Eutectic Sn-Zn Alloys and Ag substrate, Yee-Wen Yen, Chien-Chung Jaoand Chiapyng Lee, Journal of Materials Research, vol. 21, pp. 2986-2990 (2006). (SCI: 1.916)
• Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au couples, Yee-Wen Yen*, Chien-Chung Jao, Hsien-Ming Hslao, Chung-Yung Lin and Chiapyng Lee^e, Journal of Electronic Materials, vol. 36, pp. 147-158 (2007). (SCI: 1.320)
• Investigation of thermal stability of Mo Thin-Film as the Buffer Layer and Cu Metallization for Application in TFT-LCDs, Yee-Wen Yen*, Yu-Lin Kuo, Jian-Yu Chen^d, Hung-Yao Wei, Chiapyng Lee, Chung-Yu Leeand Hsin-Hung Lee, Thin Solid Films, vol. 515, pp. 7209-7216 (2007). (SCI: 1.693)
• Study of Interfacial Reactions between Sn-Ag-Cu Alloys and Au Substrate, Chien-Chung Jao, Yee-Wen Yen*, Shu-Hao Zhang, Chung-Yung Lin^, Chiapyng Lee^e, International Journal of Materials Research, vol. 98, pp. 496-500 (2007). (SCI: 0.857)
• The Effect of Non-reactive Alloying Elements on the growth Kinetics of the Intermetallic Compound between liquid Sn-based Eutectic Solders and Ni Substrates, Hung-Yung Lin, Chien-Chung Jao, Chiapyng Lee and Yee-Wen Yen, Journal of Alloys and Compounds, vol. 44, pp. 333-340 (2007). (SCI: 1.450)
• Electroenhanced Metallorganic Chemical Vapor Deposition of Copper Films, Yu-Lin Kuo, Chiapyng Lee, Gene Chen, Kou-Liang Liu, Yee-Wen Yen, Electrochemical and Solid-State Letters, vol. 10, pp. 51-54 (2007). (SCI: 2.109)
• The 260℃ Phase Equilibria of the Sn-Sb-Cu Ternary System and Interfacial Reactions at the Sn-Sb/Cu Joints Chiapyng Lee^f, Chung-Yung Lin^f, and Yee-Wen Yen, Intermetallics, vol. 15, pp.1027-1037 (2007). (SCI: 2.219)
• A DSC study on the kinetics of disproportionation reaction of (hfac)Cu^I(COD), Gene Chen, Chiapyng Lee, Yu-Lin Kuo, Yee-Wen Yen, Thermochimica Acta, vol. 456, pp. 89-93 (2007). (SCI: 1.562)
• Effect of Cu Addition on Interfacial Reaction between Sn-9Zn Lead-Free Solder and Ni Substrate, Yee-Wen Yen* and Wei-kai Liou, Journal of Materials Research, vol. 22, pp.2663-2667 (2007). (SCI: 1.916)
• Phase equilibria of the Fe-Cr-Ni ternary systems and Interfacial Reactions in the Fe-Cr/Ni Couples, Yee-Wen Yen*, Don-Ping Huang and Jian-Wei Su, Journal of Alloys and Compounds, vol.457, pp. 270-278 (2007). (SCI: 1.450)
• Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag–Cu alloy fillers in a solid oxide fuel cell system, Yee-Wen Yen*, Chun-Yu Lee, Don-Ping Huang and Jian-Wei Su, Journal of Alloys and Compounds, vol. 466, pp. 383-386 (2008). (SCI: 1.450)
• Synthesize carbon nanotubes by a novel method using chemical vapor deposition-fluidized bed reactor from solid-stated polymers, Yee-Wen Yen*, Ming-De Huang and Fu-Jen Lin, Diamond and Related Materials, vol. 17, pp.567-570 (2008). (SCI: 1.788)
• Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compounds in Molten Lead-free Solders, Yee-Wen Yen*, Weng-Ting Chou, Yu Tseng^d, Chiapyng Lee , Chung-Lei Hsu, Journal of Electronic Materials, vol. 37, pp.73-83 (2008) (SCI: 1.320)
• Phase Equilibria of the Sn-Sb-Ag Ternary System and Interfacial Reactions at the Sn-Sb/Ag Joints at 400℃ and 150℃, Chung-Yung Lin, Chiapyng Lee, Xingjun Liu and Yee-Wen Yen, Intermetallics, vol. 16, pp.230-238 (2008). (SCI: 2.219)
• Phase Equilibria of the Sn-Zn-Ag system andInterfacial Reactions in Sn-Zn/Ag couples, Chien-Chung Jao, Yee-Wen Yen* , Chiapyng Lee, Intermetallics, vol. 16, pp.463-469 (2008). (SCI: 2.219)
• The 260 °C phase equilibria of the Sn-Sb-Ag ternary system and interfacial reactions at the Sn-Sb/Ag joints, Chiapyng Lee, Chung-Yung Lin, and Yee-Wen Yen, Journal of Alloys and Compounds, vol. 458, pp. 436-445 (2008) (SCI: 1.450)
• Driver IC Design of COG Package, Yee-Wen Yen*, Chun-Yu Lee, IEEE Transactions on Advanced Packaging, vol. 31, pp. 399-406 (2008). (SCI: 1.011)
• Effect upon Minor Addition of Pb on Interfacial Reactions and Mechanical Properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu Joints, Yee-Wen Yen*, Weng-Ting Chou, Hong-Chih Chen, Wei-kai Liou, Chiapyng Lee, International Journal of Materials Research, vol. 99, pp.1251-1256 (2008). (SCI: 0.857)
• Interfacial Reactions between Pb-Free Solders and In/Ni/Cu Multilayer Substrates, Yee-Wen Yen*, Wei-Kai Liou, Hong-Yao Wei, Chiapyng Lee, Journal of Electronic Materials, vol. 38, pp.93-99 (2009). (SCI: 1.320)
• Phase Equilibria of the Au-Sn-Zn Ternary System and Interfacial Reactions in Sn-Zn/Au Couples, Wei-kai Liou and Yee-Wen Yen*, Intermetallicsvol. 17, pp.72-78 (2009). (SCI: 2.219)
• Interfacial reactions between Lead-free solders and the multilayer Au/Ni/SUS304SS substrate, Yee-Wen Yen Chun-Yu Le, Meng-Han Kuo, Kuo-Sing Chao, Kuen-da Chen, International Journal of Materials Research (in press, 2008). (SCI: 0.857)*,
• Interfacial Reactions between Sn-9Zn+Cu Lead-free Solders and the Au Substrate Wei-kai Liou and Yee-wen Yen*, Journal of Alloys and Compounds (in review 2008) (SCI: 1.450)
• 薄膜電晶體-液晶顯示器(TFT-LCD)簡介與未來發展技術趨勢，顏怡文*，Vol. 52, 化工，pp. 80-89 (2005)。
• 以實驗設計法評估錫-3.0銀-0.5銅無鉛銲料與錫-37鉛銲料與Au/Ni/Cu金屬層銲點性質之研究，曾堉、顏怡文*、陳建良、李嘉平、李俊右，中華民國界面科學會誌，29卷2期，pp. 53-60 (2007)
• 玻璃覆晶構裝(COG)製程材料參數測定與模擬，徐君蕾、蔡英宏、顏怡文*、楊雅順，化工，54卷3期，pp. 86-92 (2007).
• 電流密度與鍍錫層膜厚對霧錫結晶狀態之研究，徐君蕾、許景翔、顏怡文*、吳燈權，中華民國界面科學會誌 (已接受, 2008)
• 先進電子構裝之金屬基材與無鉛銲料界面反應，劉為開、顏怡文*，化工，55卷5期，pp. 9-16 (2008).
• Interfacial Reaction in Molten Sn/Cu and Molten In/Cu Couples, Lee-ho Su, Yee-wen Yen, Chao-ching Lin and Sinn-wen Chen, METALLURGICAL AND MATERIALS TRANSACTION B, vol. 28B, pp.927-934 (1997). (SCI: 0.621)

  會議論文

   

• Interfacial Reactions in Ag-Sn/Cu Couples, Sinn-wen Chen and Yee-wen Yen, Journal of Electronic Materials, vol. 28, pp.1203-1208 (1999). (SCI: 1.320)
• Nickel and copper deposition on fine alumina particles by using the chemical vapor deposition-circulation fluidized bed reactor technique, Yee-wen Yen and Sinn-wen Chen, Journal of Materials Science, vol.35, pp.1439-1444 (2000). (SCI: 1.081)
• Interfacial Reactions in the Sn-Ag/Au Couples, Sinn-wen Chen and Yee-wen Yen, Journal of Electronic Materials, vol. 30, pp.1133-1137 (2001). (SCI: 1.320) 
• Thermodynamic Assessment of the Hg-Sn System, Yee-wen Yen, Joachim Gröbner, Steve C. Hansen, and Rainer Schmid-Fetzer, Journal of Phase Equilibria, vol. 24, pp.151-167 (2003). (SCI: 0.449)
• Phase equilibria of the Ag-Sn-Cu ternary systems, Yee-wen Yen and Sinn-wen Chen, Journal of Materials Research, vol. 19, pp. 2298-2305 (2004). (SCI: 1.916)
• Evaluation of the thermal stability of reactively of sputtered (Ti, Zr)N_x nano-thin films as diffusion barriers between Cu and Silicon, Yu-Lin Kuo, Chiapyng Lee, Jing-Cheng Lin, Yee-wen Yen and Wen-Horng Lee, Thin Solid Films, vol. 484, pp. 265-271 (2005) (SCI: 1.693)
• Reaction Mechanism of the Two-Step MOCVD of Copper Thin Film Using Cu(hfac)2·H2O Source, Chiapyng Lee, Hsin-Hung Lee, Yee-wen Yen and Yu-Kin Kuo, Electrochemical and Solid-State Letters, vol. 8, pp. G307-G310 (2005) (SCI: 2.109)
• A novel two-step MOCVD for producing thin copper films with a mixture of ethyl alcohol and water as the additive, Hsin-Hung Lee, Chiapyng Lee, Yu-Lin Kuo and Yee-wen Yen, Thin Solid Films, vol. 498, pp. 43-49 (2006) (SCI: 1.693)
• Mesoporous, self-assembled palladium nanospheres: High efficiency activator for electroless nickel deposition, Chien-Liang Lee^g, Li-Chen Kuo, Yu-Ching Huang^g, Yee-Wen Yen, Electrochemistry Communications, vol. 8, pp. 697-702 (2006). (SCI: 4.186)
• The activation effect of Pd nanoparticles on electroless nickel-phosphorous deposition, Li-Chen Kuo, Yu-Ching Huang, Chien-Liang Lee, Yee-Wen Yen, Electrochimica Acta, vol. 52, pp. 353-360 (2006) (SCI: 2.848)
• Effects of Cu addition on the Interfacial Reaction between Eutectic Sn-Zn Alloys and Ag substrate, Yee-Wen Yen, Chien-Chung Jaoand Chiapyng Lee, Journal of Materials Research, vol. 21, pp. 2986-2990 (2006). (SCI: 1.916)
• Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au couples, Yee-Wen Yen*, Chien-Chung Jao, Hsien-Ming Hslao, Chung-Yung Lin and Chiapyng Lee^e, Journal of Electronic Materials, vol. 36, pp. 147-158 (2007). (SCI: 1.320)
• Investigation of thermal stability of Mo Thin-Film as the Buffer Layer and Cu Metallization for Application in TFT-LCDs, Yee-Wen Yen*, Yu-Lin Kuo, Jian-Yu Chen^d, Hung-Yao Wei, Chiapyng Lee, Chung-Yu Leeand Hsin-Hung Lee, Thin Solid Films, vol. 515, pp. 7209-7216 (2007). (SCI: 1.693)
• Study of Interfacial Reactions between Sn-Ag-Cu Alloys and Au Substrate, Chien-Chung Jao, Yee-Wen Yen*, Shu-Hao Zhang, Chung-Yung Lin^, Chiapyng Lee^e, International Journal of Materials Research, vol. 98, pp. 496-500 (2007). (SCI: 0.857)
• The Effect of Non-reactive Alloying Elements on the growth Kinetics of the Intermetallic Compound between liquid Sn-based Eutectic Solders and Ni Substrates, Hung-Yung Lin, Chien-Chung Jao, Chiapyng Lee and Yee-Wen Yen, Journal of Alloys and Compounds, vol. 44, pp. 333-340 (2007). (SCI: 1.450)
• Electroenhanced Metallorganic Chemical Vapor Deposition of Copper Films, Yu-Lin Kuo, Chiapyng Lee, Gene Chen, Kou-Liang Liu, Yee-Wen Yen, Electrochemical and Solid-State Letters, vol. 10, pp. 51-54 (2007). (SCI: 2.109)
• The 260℃ Phase Equilibria of the Sn-Sb-Cu Ternary System and Interfacial Reactions at the Sn-Sb/Cu Joints Chiapyng Lee^f, Chung-Yung Lin^f, and Yee-Wen Yen, Intermetallics, vol. 15, pp.1027-1037 (2007). (SCI: 2.219)
• A DSC study on the kinetics of disproportionation reaction of (hfac)Cu^I(COD), Gene Chen, Chiapyng Lee, Yu-Lin Kuo, Yee-Wen Yen, Thermochimica Acta, vol. 456, pp. 89-93 (2007). (SCI: 1.562)
• Effect of Cu Addition on Interfacial Reaction between Sn-9Zn Lead-Free Solder and Ni Substrate, Yee-Wen Yen* and Wei-kai Liou, Journal of Materials Research, vol. 22, pp.2663-2667 (2007). (SCI: 1.916)
• Phase equilibria of the Fe-Cr-Ni ternary systems and Interfacial Reactions in the Fe-Cr/Ni Couples, Yee-Wen Yen*, Don-Ping Huang and Jian-Wei Su, Journal of Alloys and Compounds, vol.457, pp. 270-278 (2007). (SCI: 1.450)
• Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag–Cu alloy fillers in a solid oxide fuel cell system, Yee-Wen Yen*, Chun-Yu Lee, Don-Ping Huang and Jian-Wei Su, Journal of Alloys and Compounds, vol. 466, pp. 383-386 (2008). (SCI: 1.450)
• Synthesize carbon nanotubes by a novel method using chemical vapor deposition-fluidized bed reactor from solid-stated polymers, Yee-Wen Yen*, Ming-De Huang and Fu-Jen Lin, Diamond and Related Materials, vol. 17, pp.567-570 (2008). (SCI: 1.788)
• Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compounds in Molten Lead-free Solders, Yee-Wen Yen*, Weng-Ting Chou, Yu Tseng^d, Chiapyng Lee , Chung-Lei Hsu, Journal of Electronic Materials, vol. 37, pp.73-83 (2008) (SCI: 1.320)
• Phase Equilibria of the Sn-Sb-Ag Ternary System and Interfacial Reactions at the Sn-Sb/Ag Joints at 400℃ and 150℃, Chung-Yung Lin, Chiapyng Lee, Xingjun Liu and Yee-Wen Yen, Intermetallics, vol. 16, pp.230-238 (2008). (SCI: 2.219)
• Phase Equilibria of the Sn-Zn-Ag system andInterfacial Reactions in Sn-Zn/Ag couples, Chien-Chung Jao, Yee-Wen Yen* , Chiapyng Lee, Intermetallics, vol. 16, pp.463-469 (2008). (SCI: 2.219)
• The 260 °C phase equilibria of the Sn-Sb-Ag ternary system and interfacial reactions at the Sn-Sb/Ag joints, Chiapyng Lee, Chung-Yung Lin, and Yee-Wen Yen, Journal of Alloys and Compounds, vol. 458, pp. 436-445 (2008) (SCI: 1.450)
• Driver IC Design of COG Package, Yee-Wen Yen*, Chun-Yu Lee, IEEE Transactions on Advanced Packaging, vol. 31, pp. 399-406 (2008). (SCI: 1.011)
• Effect upon Minor Addition of Pb on Interfacial Reactions and Mechanical Properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu Joints, Yee-Wen Yen*, Weng-Ting Chou, Hong-Chih Chen, Wei-kai Liou, Chiapyng Lee, International Journal of Materials Research, vol. 99, pp.1251-1256 (2008). (SCI: 0.857)
• Interfacial Reactions between Pb-Free Solders and In/Ni/Cu Multilayer Substrates, Yee-Wen Yen*, Wei-Kai Liou, Hong-Yao Wei, Chiapyng Lee, Journal of Electronic Materials, vol. 38, pp.93-99 (2009). (SCI: 1.320)
• Phase Equilibria of the Au-Sn-Zn Ternary System and Interfacial Reactions in Sn-Zn/Au Couples, Wei-kai Liou and Yee-Wen Yen*, Intermetallicsvol. 17, pp.72-78 (2009). (SCI: 2.219)
• Interfacial reactions between Lead-free solders and the multilayer Au/Ni/SUS304SS substrate, Yee-Wen Yen Chun-Yu Le, Meng-Han Kuo, Kuo-Sing Chao, Kuen-da Chen, International Journal of Materials Research (in press, 2008). (SCI: 0.857)*,
• Interfacial Reactions between Sn-9Zn+Cu Lead-free Solders and the Au Substrate Wei-kai Liou and Yee-wen Yen*, Journal of Alloys and Compounds (in review 2008) (SCI: 1.450)
• 薄膜電晶體-液晶顯示器(TFT-LCD)簡介與未來發展技術趨勢，顏怡文*，Vol. 52, 化工，pp. 80-89 (2005)。
• 以實驗設計法評估錫-3.0銀-0.5銅無鉛銲料與錫-37鉛銲料與Au/Ni/Cu金屬層銲點性質之研究，曾堉、顏怡文*、陳建良、李嘉平、李俊右，中華民國界面科學會誌，29卷2期，pp. 53-60 (2007)
• 玻璃覆晶構裝(COG)製程材料參數測定與模擬，徐君蕾、蔡英宏、顏怡文*、楊雅順，化工，54卷3期，pp. 86-92 (2007).
• 電流密度與鍍錫層膜厚對霧錫結晶狀態之研究，徐君蕾、許景翔、顏怡文*、吳燈權，中華民國界面科學會誌 (已接受, 2008)
• 先進電子構裝之金屬基材與無鉛銲料界面反應，劉為開、顏怡文*，化工，55卷5期，pp. 9-16 (2008).

會議論文

• 鎳基材與熔融銅銀合金界面反應；蘇立和，顏怡文，羅惠慈, 陳信文；中國材料科學學會84年度年會。
• Titanium Deposition on the Alumina Particales by Using CVD-FBR    Technology, Chih-chi Chen, Sinn-wen Chen, and Yee-wen Yen, 1995 AIChE Annual Meeting.
• 以化學氣相沈積-循環式流體化床反應器進行氧化鋁粉粒表面鍍鎳與鍍銅；顏怡文，陳信文；1996輸送現象與其應用專題研討會，pp.191-196(1996)，桃園中壢。
• 熔融銀-錫銲料與銅基材的界面反應；顏怡文，陳信文；1997輸送現象與其應用專題研討會， pp427-432(1997)，台北。
• 銀-錫合金與銅基材的界面反應；顏怡文，陳信文；1998中國材料科學學會1998年度年會論文集(H)，電子構裝，pp63-66(1998)，台北。
• 銀-錫-銅三元系統在450℃與240℃的相平衡；顏怡文，陳信文；中國材料科學學會1999年度年會論文集(L)，新竹。
• Interfacial Reactions in the Ag-Sn/Cu Couples, Sinn-wen Chen and Yee-wen Yen, 128th TMS Annual Meeting, San Diego, California, USA (1999).
• Phase Diagram Calculation and Its Applications, Sinn-wen Chen and Yee-wen Yen, Presented at Workshop on Computational Materials Science, National Center for High-Performance Computing, Hsin-Chu, Taiwan, ROC(1999)
• 無鉛銲料與基材的界面反應；顏怡文，陳信文；第六屆破壞科學研討會，屏東 墾丁。
• Phase Equilibria of Ag-Sn-Cu Ternary System, Yee-wen Yen and Sinn-wen Chen, 129th TMS Annual Meeting, Nashville TN, USA (2000).
• 銀-錫合金與金基材的界面反應；顏怡文、陳信文；中國材料科學會學會公元2000年年會論文集H-03，高雄。
• Interfacial reactions in the Ag-Sn/Au couples, Sinn-wen Chen and Yee-wen Yen, 130th TMS Annual Meeting, New Orleans, Louisiana, USA (2001).
• 錫-銀/銅與錫-銦/銅系統界面反應反應的熱力學與動力學探討(III)；陳信文、許秀鳳、申有田、顏怡文；2002化工年會，嘉義。
• Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au couples, Yee-wen Yen*, Chien-Chung Jao, Hsien-Ming Hslao, Chiapyng Lee, Yu Tseng, Yu-Lin Ku and Chung-Yu Lee, 135th TMS Annual Meeting, San Antonio, Texas, USA (2006). (oral)
• Effects upon the Sn-9Zn/Ag Interfacial Reactions with Minor additions of Cu in Sn-Zn Alloys, Chien-Chung Jao, Yee-Wen Yen* and Chiapyng Lee, IMAPS Taiwan 2006 - International Exhibition and Technical Symposium2006 國際微電子構裝(台灣)展示及研討會, 台北。(oral)
• Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compounds in Molten Lead-free Solders, Yee-wen Yen*, Weng-Ting Chou, Yu Tseng, Chiapyng Lee , Chung-Lei Hsu,136th TMS Annual Meeting, Orlando, FL, USA (2007). (oral)
• A novel method to synthesize carbon nanotubes by using chemical vapor deposition-fluidized bed reactor from solid-stated polymers, Yee-wen Yen*, Ming-De Huang and Fu-Jen Lin, 2007 New Diamond and Nano Carbons, Osaka, Japan (2007). (poster)
• Interfacial reactions between interconnect materials-Ni/stainless steel 430 and Ag-Cu alloy fillers in the solid oxide fuel cell system, Yee-wen Yen*, Chung-yu Lee, Don-ping Huang and Jian-wei Su, The 16th International Conference on Solid State Ionic, Shanghai, China (2007). (poster)
• Interfacial Reactions in the Pb-Free Solders with In/Ni/Cu, Yee-wen Yen*, Wei-kai Liou ,Hong-yao Wei, Chiapyng Lee, 137th TMS Annual Meeting, New Orleans, LA, USA (2008). (oral)
• Interfacial Reactions between Sn–9Zn+Cu Lead-free Solders and the Au Substrate, Wei-kai Liou and Yee-wen Yen*, The 3^rd IMPACT and 10^th EMAP Joint Conference, Taipei, Taiwan (2008). (oral)
• Interfacial Reactions on Lead-free solders with Pd/Au/Ni/Cu and Pd/Au/Ni/Brass Multilayer substrates, Yee-wen Yen*, Yang-kai Fang, Chiapyng Lee, 138th TMS Annual Meeting, San Francisco, CA, USA (2009). (oral)
• Interfacial Reactions in the Sn-9Zn+Cu Solder with Ni Substrate, Wei-kai Liouand Yee-wen Yen*, 138th TMS Annual Meeting, San Francisco, CA, USA (2009). (oral)
• Investigation of the Phase Equilibria of the Sn-Cu-Au ternary system and Interfacial Reactions in Sn-Cu/Au couples, Hsien-Ming Hslao, Yee-wen Yen*, Chiapyng Lee, 2005 Taiwan Printed Circuit Association International Forum, Taipei, Taiwan. (優秀論文獎)
• Study on growing Mo as the buffer layer and investigation in Cu diffusion phenomena in TFT-LCDs; Yee-wen Yen*, Jian-Yu Chen, Chiapyng Lee, Hung-Yao Wei, Yu-Lin Kuo, Hsin-Hung Lee, 2005電子元件暨材料研討會,高雄。
• 錫-銅合金與金基材界面反應之研究；顏怡文*、蕭憲明、饒建中、李嘉平、曾堉、郭俞麟；2005化工年會；苗栗。
• 超大型積體電路銅製程中擴散阻障層(Ti,Zr)Nx之特性研究；李嘉平、郭俞麟、顏怡文、李欣浤；2005化工年會；苗栗。
• 錫-銅-金三元與銀-錫-銅-金四元相平衡之研究；饒建中、顏怡文*、蕭憲明、李嘉平、曾堉；2005材料年會，台北。
• 微量元素添加於銀-錫-銅無鉛銲料中與銅基材界面反應之研究；饒建中、顏怡文*、李嘉平；2005材料年會，台北。
• 鐵-鉻合金與鎳基材界面反應及鐵-鉻-鎳三元系統相平衡之研究；黃東平、顏怡文*、李嘉平、郭俞麟；2005材料年會，台北。
• 以實驗設計法評估錫-3.0銀-0.5銅無鉛銲料與錫-37鉛銲料與Au/Ni/Cu金屬層銲點性質之研究；曾堉、顏怡文*、陳建良、李嘉平、李俊右；2005材料年會，台北。
• 二元錫系銲料與鎳基材的界面反應動力學研究；林忠永、李嘉平、顏怡文；2005材料年會，台北。
• 銀-銅填料與固態氧化物燃料電池中雙極板間的界面反應之研究, 顏怡文*，黃東平，第一屆台灣氫能與燃料電池學術研討會，南投(2006)。 (最佳論文獎)
• 鐵-鉻合金與鎳基材間介面反應的研究，顏怡文*、黃東平、蘇建瑋，2006中國材料科學會年會，台南 (2006)。
• 電流密度對霧錫膜厚與結晶狀態之研究，徐君蕾、許景翔、顏怡文*、吳燈權，2006中國材料科學會年會，台南 (2006)。
• 探討微量鉛對無鉛銲料與銅基材接點之影響，顏怡文*、陳鴻志、劉為開、李嘉平，2006中國材料科學會年會，台南 (2006)。
• 錫-鋅-銀三元系統相平衡之研究，饒建中、顏怡文*、李嘉平，2006中國材料科學會年會，台南 (2006)。
• The 260℃ Phase Equilibria of the Sn-Sb-Ag Ternary System ，林忠永、李嘉平、顏怡文，2006中國材料科學會年會，台南 (2006)。
• 260℃Sn-Sb-Cu三元系相圖及Sn-Sb/Cu界面反應，林忠永、李嘉平、顏怡文，中國材料科學會年會，台南 (2006)。
• 400℃Sn-Sb-Ag三元系相圖及Sn-Sb/Ag界面反應，林忠永、李嘉平、顏怡文，中國材料科學會年會，台南 (2006)。
• 金屬與介金屬基材在無鉛銲料中溶解現象的研究，曾堉、顏怡文*、李嘉平、饒建中，2006台灣化工學會年會，高雄 (2006)。
• 玻璃覆晶構裝(COG)製程材料參數測定與模擬，徐君蕾、蔡英宏、顏怡文*、楊雅順 2006台灣化工學會年會，高雄 (2006)。
• 無鉛銲料與鎳-鉬合金界面反應的研究，劉家昇、顏怡文*，2006台灣化工學會年會，高雄 (2006)。
• 無鉛銲料與不鏽鋼基材間界面反應之研究，郭孟翰、許景翔、顏怡文*、吳燈權，2006台灣化工學會年會，高雄 (2006)。
• 無鉛銲料與In/Ni/Cu界面反應之研究，魏弘堯、劉為開、顏怡文*、李嘉平、黃孟?，2006台灣化工學會年會，高雄 (2006)。
• 錫-鋅無鉛銲料與銀基材基材間界面反應之研究，饒建中、顏怡文*、李嘉平，2006台灣化工學會年會，高雄 (2006)。
• Sn-9wt%Zn無鉛銲料添加Cu與Ni基材界面反應機制之研究，劉為開、顏怡文*，2007 Taiwan Printed Circuit Association International Forum, Taipei, Taiwan (2007). (優秀論文獎)
• NiP和Ni擴散阻障在錫層與銅基材間之界面反應與錫鬚成長機制，顏怡文*、劉為開、許景翔，2007中國材料科學會年會，新竹 (2007)。
• 無鉛銲料與Au/Pd/Ni/Cu基材界面反應之研究，方揚凱、顏怡文*、劉為開、李嘉平、許景翔，2007中國材料科學會年會，新竹 (2007)。
• 錫-鉍銲料與金基材界面反應之研究，顏怡文*、陳昭銘、劉為開、黃孟?，2007中國材料科學會年會，新竹 (2007)。
• The 400 ℃ Phase Equilibria of the Sn-Sb-Cu Ternary System and Interfacial Reactions at the Sn-Sb/Cu Joints, 林忠永、李嘉平、顏怡文、丁慶瑞，2007中國材料科學會年會，新竹 (2007)。
• The Effect of Non-reactive Alloying Elements on the Growth Kinetics of the Intermetallic Compound between Ni particle reinforcements and Liquid Sn-based Eutectic Solders, 林忠永、李嘉平、丁慶瑞、顏怡文，2007中國材料科學會年會，新竹 (2007)。
• The 150 ℃ Phase Equilibria of the Sn-Sb-Cu Ternary System and Interfacial Reactions at the Sn-Sb/Cu Joints, Chung-Yung Lin、Chiapyng Lee、Wen-Horng Lee、Yee-Wen Yen，2007台灣化工學會年會，林口 (2007)。
• Experimental Study of the Sn-Sb-Zn Phase Diagram at 150℃, Chung-Yung Lin、Chiapyng Lee、Wen-Horng Lee、Yee-Wen Yen， 2007台灣化工學會年會，林口 (2007)。
• The 260℃ Phase Equilibria of the Sn-Bi-Cu Ternary System and Interfacial Reactions at the Sn-Bi/Cu Joints, Chung-Yung Lin、Chiapyng Lee、Wen-Horng Lee、Yee-Wen Yen，台灣化工學會年會，林口 (2007)。
• 固態高分子以化學氣相沈積-流體化床反應器對於使用硝酸鐵、氯化亞鐵以及氯化鎳之催化劑成長奈米碳管影響之研究，林福仁、顏怡文*，2007台灣化工學會年會，林口 (2007)。
• 無鉛銲料與Au/Ni/SUS304基材間界面反應之研究，陳昆達、顏怡文*，2007台灣化工學會年會，林口 (2007)。
• 電鍍霧錫系統中電流密度對錫鬚晶成長機制之探討，徐君蕾、顏怡文*，2007台灣化工學會年會，林口 (2007)。
• BGA構裝技術中Sn-Ag-Cu與Sn-Ag-Cu-Ni-Ge無鉛銲料與Au/Ni/Cu多層結構之界面反應，江昱成、顏怡文*、李嘉平、蕭碧玉，2007台灣化工學會年會，林口 (2007)。 (壁報論文專題競賽特優獎)
• 無鉛銲料與鎳-鉬基材界面反應的研究，劉為開、劉家昇、顏怡文*，2007台灣化工學會年會，林口 (2007)。
• 液晶顯示器中應用不同尺寸印刷電路板於接合過程下熱膨脹現象之研究，郭孟翰、顏怡文*、曾堉、周詩頻，2007台灣化工學會年會，林口 (2007)。
• 無鉛銲料與鎳基材溶解行為之研究，郭孟翰、顏怡文*，2007台灣化工學會年會，林口 (2007)。
• 固態氧化物燃料電池(SOFC)系統中Silver ABA商用填料與鎳-釔安定化氧化鋯(Ni-YSZ)、不鏽鋼雙極板間之界面反應，顏怡文*、劉為開、黃東平，第二屆台灣氫能與燃料電池學術研討會，台北 (2008)。
• BGA構裝中SAC 與SACNG無鉛銲料與Au/Ni/Cu多層結構之界面反應與銲點破壞性質，江昱成、顏怡文*、李嘉平，2008 Taiwan Printed Circuit Association International Forum, Taipei, Taiwan (2008). (優秀論文獎)
• 無鉛銲錫與Au/Pd/Ni/Cu、Au/Pd/Ni/Brass基材之界面反應，方揚凱、顏怡文*、李嘉平，2008 Taiwan Printed Circuit Association International Forum, Taipei, Taiwan (2008). (優秀論文獎)
• 錫-鉍銲料與金基材界面反應之研究，陳昭銘、顏怡文*、黃孟?，2008 Taiwan Printed Circuit Association International Forum, Taipei, Taiwan (2008). (佳作)
• NiP和Ni擴散阻障在錫層與銅基材間界面反應與錫鬚成長機制之研究，劉為開、顏怡文*，2008 Taiwan Printed Circuit Association International Forum, Taipei, Taiwan (2008). (佳作)

• 化工在現今半導體工業中的角色；顏怡文*；化工技術，79期，pp. 198-201(1999)。
• 第二次波灣戰爭核生化作戰之研析，胡國智、顏怡文，核生化防護學術半年刊期，76期，pp.4-15(2003)。
• 大視界-顯示器面面觀，顏怡文*，化工技術，143期，pp. 159-162 (2005)。
• 電子構裝中銅基材與無鉛銲料界面反應之文獻回顧，顏怡文^*、方揚凱、江昱成、陳昭銘、李嘉平、黃孟?，化工技術，176期，pp.211-223 (2007)。
• 電子構裝中鎳基材與無鉛銲料界面反應之文獻回顧；劉為開，顏怡文^*，郭孟翰，化工技術，184期，pp.224-236 (2008)。

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