教授課程

偏微分方程在工程上之應用
機電光系統光學訊號處理
微積分

 Publications

• Z. R. Huang, D. Guidotti, L. Wan, Y. J. Chang, J. Yu, J. Liu, H. F. Kuo, G. K. Chang, F. Liu, and R. R. Tummala, “Hybrid integration of end-to-end optical internnects on printed circuit boards,” IEEE Trans. Compon. Packag. Technol. Vol. 30, pp.708-715, Dec. 2007.
• L. B. Chang, C. H. Chang, M. J. Jeng, H. C. Chiu, and H. F. Kuo, “Barrier Height Enhancement of AlxGa1-xN/GaN Schottky Diodes Prepared by P2S5/(NH4)2S Treatments,” Electrochemical and Solid-State Letters, 10 (3) H79-H81 2007.
• G. K. Chang, D. Guidotti, Z. R. Huang, L. Wan, J. J. Yu, S. Hegde, H. F. Kuo, Y. J. Chang, F. H. Liu, F. T. Wang, and R. Tummala, “High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems,” SPIE Invited talk, FL Mar. 2005.
• S. W. Seo, S. Y. Cho, H. F. Kuo, and N. M. Jokerst, “Optical interconnection using embedded thin film edge emitting lasers, photodetectors, and polymer waveguides,” The 2004 IEEE-LEOS summer meeting, July 2004.
• H. F. Kuo, S. Y. Cho, and N. M. Jokerst, “Heterogeneous integration of InP/InGaAsP MQW thin film edge emitting lasers and polymer waveguides,” The 54th IEEE-ECTC, June 2004.(EI)
• H. F. Kuo, S. Y. Cho, J. Hall, and N. M. Jokerst, “InP/InGaAsP MQW thin film edge emitting lasers for embedded waveguide chip to chip optical interconnections,” The 16th IEEE-LEOS, Annual, Oct. 2003.
  

Patents

• Y. H. Yang and H. F. Kuo, “Quantum Cascaded Laser at Wavelength 10μm for Laser Engraver in XY Table,” Taiwan patent no. M313029, issued June 2007; Austria patent no. 9630, issued Feburary 2007.
• M. Chang and H. F. Kuo, “Laser Marking Machine with Multiple Scanheads,” Germany patent no. 202007000175.4, issued February 2007; Japan patent no. 3129877, issued Feburary 2007; Taiwan patent no. M313067, issued June 2007.